Governor Hochul Announces $25 Million Competitive Solicitation for New Downstate Chip Design Center

Delivers on Governor's 2026 State of the State Proposal To Extend the State’s Unparalleled Semiconductor Success to Downstate New York

New Center Will Bridge Critical Innovation Gap and Solidify New York’s Global Leadership Across the Complete Semiconductor Supply Chain

Governor Hochul today announced the launch of a competitive Request for Applications (RFA) offering up to $25 million in capital grant funding to establish a world-class Semiconductor Design Center in Downstate New York. The initiative aims to activate the Downstate region's world-class tech workforce and leading research institutions to attract investment from the fastest growing semiconductor sector,, chip design.

“New York has become the nation’s semiconductor leader by making historic investments in the people, places and infrastructure needed to bring this critical industry back to America,” Governor Hochul said. “This $25 million investment will build on that success by harnessing Downstate’s unmatched talent, research institutions and technology ecosystem to establish New York as a global center for chip design. By ensuring the technologies of tomorrow are both designed and manufactured here, we are creating good-paying jobs, attracting new investment and strengthening every link in New York’s semiconductor supply chain.”

Empire State Development President, CEO and Commissioner Hope Knight said, “New York’s semiconductor ecosystem is expanding to New York City and the broader Downstate region, making the industry’s tremendous economic potential a truly statewide opportunity. By connecting Upstate’s world-class research and manufacturing assets with Downstate’s unmatched technology talent, leading academic institutions, startup community and venture capital network, the Downstate Chip Design Center will strengthen every link in the semiconductor supply chain and ensure the chips of the future are both designed and built in New York.”

Read the full press release here.

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